The test plan for a product should cover the whole product life-cycle and include: prototype debugging, manufacturing tests and field service repairs. The tools that can be used to locate a problem on a failing Printed Circuit Board Assembly (PCBA) depend on whether design data of the board is available or not, and whether test programs for the board already exist.

But conventional structural testing requires probing of device pins. With miniaturization, probing is no longer possible, and thus structural testing using external probes becomes impossible. With boundary-scan external probing is no longer needed.

In production testing is too often considered as a ‘no value-added’ proposition. However, this viewpoint ignores the real and substantial savings that can be realized with a well-conceived test strategy. High quality assembly and inspection equipment minimizes the chance for assembly errors. Test equipment is still needed to help detect remaining errors efficiently.

The challenge is to generate the best test strategy and choose the right tools to use in the production phase.

What can be done to shorten repair times?

Watch the video and download the free white paper:

‘Faster repair in the era of miniaturization’

Wir helfen Ihnen gerne weiter!

Durch die enge Zusammenarbeit mit unseren Kunden konnten wir Tausende Testprobleme lösen. Sobald Sie Kunde von JTAG Technologies werden, sind Sie ein integraler Bestandteil unseres Unternehmen und haben ebenfalls vollen Zugriff auf unser weltweites Support-Netzwerk.